IPC - advanced level

Objectives: understanding the acceptable quality requirements for electronic assemblies (PCBs) and the acceptance criteria in order to correctly decide on the products. Learning the skills to identify possible causes for non-conformities that appear in the gluing/production process.

Target audience: engineers from quality, process engineering, production departments, team leaders / departments in companies that produce electronic assemblies (PCBs)

Duration: 3 days

Agenda:
• Introduction
• Introductory elements about electronic components (BEC-Basic electronic components);
• Module 1 Generalities, scope, classification and acceptance criteria;
• Module 2 Terms and definitions, applicable documents;
• Module 3 Handling of electronic assemblies;
• Module 4 Hardware, installation and fixing/arranging group of wires;
• Module 5 Soldering, soldering anomalies and practical applications;
• Module 6 Contacts on electrical terminals, wires;
• Module 7 Technology of assembling components with terminals in holes (THT);
• Applications.
• Module 8 Surface mounted assemblies (SMT);
• Module 9 Damage to components;
• Module 10 Boards with printed circuits and assemblies;
• Module 11 Electric circuits with discrete wires;
• Module 12 High voltage;
• Discussions. Examination. Closing course

Lecturer: The experience of over 10 years in the industry and in the application of the standard.

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